A highly bendable thin film encapsulation by the modulation of thermally induced interfacial residual stress

Author

Yong Cheon Park, Taehyun Kim, Hye Rin Shim, YoungWoo Choi, Seungbum Hong, Seunghyup Yoo, Sung Gap Im

Journal

Applied Surface Science

Vol

598 (1)

Page

153874

Year

2022

Link

https://doi.org/10.1016/j.apsusc.2022.153874 875회 연결